Tag Archives: VCSEL

Thermal management optimization in high-power 3D sensing VCSELs

March 4, 2022 by Modulight Content
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Published in: SPIE LASE 2022 Authors: A. Filipchuk, K. Nechay, R. Ulkuniemi, S. Talmila, P. Uusimaa  Published in: SPIE LASE 2022 Authors: A. Filipchuk, K. Nechay, R. Ulkuniemi, S. Talmila, P. Uusimaa Vertical-cavity surface-emitting lasers (VCSELs) have recently paved their way into the 3D sensing market, specifically in mobile device applications. Vertical emission of VCSELs enables arranging single emitters into high-power 2D arrays. Thus, VCSEL arrays require efficient heat management which can be implemented by the means of packaging, both to improve thermal conductivity and to keep VCSEL chips intact. This becomes particularly important when considering also very high-density laser arrays and 2D matrices for quantum Continue reading →

High-efficiency vertically-emitting chipsets for 3D and proximity sensing

March 5, 2021 by Modulight Content
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Published in: SPIE LASE 2021 Authors: K. Nechay, R. Ulkuniemi, A. Filipchuk, T. Hartikainen, V. Kaivosoja, R. Hietikko, J. Nikkinen, J. Sillanpaa, P. Melanen, V. Vilokkinen, S. Talmila, P. Uusimaa  Published in: SPIE LASE 2021 Authors: K. Nechay, R. Ulkuniemi, A. Filipchuk, T. Hartikainen, V. Kaivosoja, R. Hietikko, J. Nikkinen, J. Sillanpaa, P. Melanen, V. Vilokkinen, S. Talmila, P. Uusimaa Vertical-cavity surface-emitting lasers (VCSELs) have just recently started generating a lot of interest as the illumination source in the multitude of commercial applications. VCSELs capability to provide narrow spectrum emission with low temperature sensitivity and high beam quality, coupled with the possibility of nanosecond pulses generation, makes VCSELs an excellent laser platform for the outdoors, high-precision Continue reading →