Tag Archives: partnership

Modulight improves customer service in California, Arizona and near by regions

March 26, 2004 by Anca Guina
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Tampere, March 26th, 2004 – Modulight, Inc. (Tampere, Finland) and Reichenbach International, Inc. (Westlake Village, California) have today announced a long-term marketing cooperation. Reichenbach International’s offices in Los Angeles, Orange County, San Diego, San Jose, Sacramento, and Phoenix will serve Modulight’s customers in California, Nevada, Arizona, New Mexico and Utah. "We are very pleased to team up with Reichenbach International to support our customers in the region. Their long expertise in getting design-in’s with well known fiber optic companies will definitely be helpful for us Continue reading →

Modulight enters Israeli market in cooperation with Migvan

January 22, 2004 by Seppo Orsila
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Tampere, January 22nd, 2004, Modulight, Inc. (Tampere, Finland) and Migvan Technologies & Engineering (Tel Aviv, Israel) signed today a representative agreement, which enables immediate availability of Modulight’s products into Israeli market. Modulight offers optoelectronic (OE) epiwafers, OE chips (lasers) and packaged laser components such as TO-cans and fiber pigtailed laser modules. Customized laser chips and foundry services are supporting well Modulight’s broad product and service portfolio. Modulight’s Fabry-Pérot and DFB laser dies, from lower speeds up to 10Gb/s, are available as standard products in volumes, Continue reading →

Modulight strengthens its position in Japan

December 2, 2002 by Seppo Orsila
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Tampere, December 2nd, 2002 – Modulight, Inc. (Tampere, Finland) and High-Tech Corporation (Tokyo, Japan) have signed a distribution agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in Japanese market. Modulight’s product portfolio covers optoelectronic (OE) epiwafers, OE chips and packaged components. High-Tech Corporation and Modulight provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight works in close co-operation with customers, offering them high product performance, customized products, Continue reading →

Modulight and Jinsan Scientific into marketing partnership

July 8, 2002 by Seppo Orsila
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Tampere, July 08, 2002 – Modulight, Inc. and Jinsan Scientific have signed a marketing and sales partnership agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in South-Korean market. Modulight’s product category covers Optoelectronic (OE) epiwafers, OE chips and packaged chips. Working together, Jinsan Scientific and Modulight are able to provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight works in close cooperation with customers, bringing this way better results in Continue reading →

Modulight and Mi-Net into marketing partnership

May 3, 2002 by Seppo Orsila
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Tampere, May 03, 2002 – Modulight, Inc. and Mi-Net Technology Ltd. have signed a marketing and sales partnership agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in United Kingdom market. Modulight’s product category covers Optoelectronic (OE) epiwafers, OE chips and packaged chips. Working together, Mi-Net Technology Ltd. and Modulight are able to provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight aims to qualify products together with customers, bringing Continue reading →