Tag Archives: Japan

Modulight joins Finnish Ministerial delegation to Japan between 6th and 8th of October

Ms. Leena Luhtanen, the Finnish Minister of Transport and Communications will lead a Business Delegation visit to Japan in October, 6th-8th. The aim of the visit is to promote bilateral trade between Finland and Japan and to build relationships with high-level authorities and business leaders. Represented by Mr. Petteri Uusimaa, President & CEO, Modulight will join the business delegation together with other high-level representatives of well-known Finnish companies. Other participating companies of the delegation are Comptel, Cybelius Software, Elcoteq Japan, Elektrobit, Hantro Product, Jutel, Nokia, Continue reading →

Modulight strengthens its position in Japan

Tampere, December 2nd, 2002 – Modulight, Inc. (Tampere, Finland) and High-Tech Corporation (Tokyo, Japan) have signed a distribution agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in Japanese market. Modulight’s product portfolio covers optoelectronic (OE) epiwafers, OE chips and packaged components. High-Tech Corporation and Modulight provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight works in close co-operation with customers, offering them high product performance, customized products, Continue reading →