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Modulight enters Israeli market in cooperation with Migvan

Tampere, January 22nd, 2004, Modulight, Inc. (Tampere, Finland) and Migvan Technologies & Engineering (Tel Aviv, Israel) signed today a representative agreement, which enables immediate availability of Modulight’s products into Israeli market. Modulight offers optoelectronic (OE) epiwafers, OE chips (lasers) and packaged laser components such as TO-cans and fiber pigtailed laser modules. Customized laser chips and [...]

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Modulight enhances customer service in China through distribution agreement with Broadtechs

Tampere, June 19th, 2003 – Modulight, Inc. (Tampere, Finland) and Broadtechs (Shanghai, China) have signed a distribution agreement that results in immediate improvement in customer support and sales activity of Modulight’s telecom and datacom lasers in Chinese market. The purpose of the agreement is to sell and promote Modulight’s products widely to China. Modulight’s product

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