Author Archives: Seppo Orsila

Modulight enhances customer service in China through distribution agreement with Broadtechs

June 19, 2003 by Seppo Orsila
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Tampere, June 19th, 2003 – Modulight, Inc. (Tampere, Finland) and Broadtechs (Shanghai, China) have signed a distribution agreement that results in immediate improvement in customer support and sales activity of Modulight’s telecom and datacom lasers in Chinese market. The purpose of the agreement is to sell and promote Modulight’s products widely to China. Modulight’s product portfolio covers optoelectronic (OE) epiwafers, OE chips and packaged laser components. Broadtechs has significant experience in distributing optoelectronic products and long-time presence in Chinese market. With its offices in Shanghai, Continue reading →

Modulight introduces 10 Gb/s Fabry-Pérot laser

January 10, 2003 by Seppo Orsila
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Tampere, Finland, Januray 10th, 2003 – Modulight, Inc., a manufacturer of high- performance optical semiconductor components, today announced that its new 1310 nm Fabry-Pérot laser chip for 10 Gb/s transmission is available for purchase in volumes. The product is especially designed for uncooled serial 10 Gb/s transceivers and transponders for very short reach link distances. With this latest addition to its product portfolio, Modulight completes its 1310 nm FP product family, previously already offering products for up to 2.5 Gb/s modulation speeds. The 100 % tested 10 Gb/s FP laser chip is Continue reading →

Modulight strengthens its position in Japan

December 2, 2002 by Seppo Orsila
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Tampere, December 2nd, 2002 – Modulight, Inc. (Tampere, Finland) and High-Tech Corporation (Tokyo, Japan) have signed a distribution agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in Japanese market. Modulight’s product portfolio covers optoelectronic (OE) epiwafers, OE chips and packaged components. High-Tech Corporation and Modulight provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight works in close co-operation with customers, offering them high product performance, customized products, Continue reading →

Modulight awarded a government contract to develop next generation components

September 17, 2002 by Seppo Orsila
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Tampere, September 17th, 2002 – Modulight, Inc., an ISO 9001:2000 certified manufacturer of high-performance optical components for telecommunications, announced government contracts for developing next generation optical components for high performance telecommunication systems. Part of the funding comes from National Technology Agency of Finland (Tekes). 18 and 24 months programsa have a total budget of about 0,8M EUR . “We have a number of promising young companies in the field of optical communications, and Modulight certainly excels in MBE processing of high-end quality components. Tekes wishes to Continue reading →

Modulight and Jinsan Scientific into marketing partnership

July 8, 2002 by Seppo Orsila
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Tampere, July 08, 2002 – Modulight, Inc. and Jinsan Scientific have signed a marketing and sales partnership agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in South-Korean market. Modulight’s product category covers Optoelectronic (OE) epiwafers, OE chips and packaged chips. Working together, Jinsan Scientific and Modulight are able to provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight works in close cooperation with customers, bringing this way better results in Continue reading →

Modulight and Mi-Net into marketing partnership

May 3, 2002 by Seppo Orsila
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Tampere, May 03, 2002 – Modulight, Inc. and Mi-Net Technology Ltd. have signed a marketing and sales partnership agreement that results in immediate co-operation. The purpose of the agreement is to sell and promote Modulight’s products in United Kingdom market. Modulight’s product category covers Optoelectronic (OE) epiwafers, OE chips and packaged chips. Working together, Mi-Net Technology Ltd. and Modulight are able to provide product solutions that cover processing of OE component to the levels specified by the customers. Modulight aims to qualify products together with customers, bringing Continue reading →

Modulight introduces 1310 nm laser products

March 14, 2002 by Seppo Orsila
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Tampere, March 14, 2002 – Modulight, Inc., a manufacturer of high-performance semiconductor components for optical fiber communication today announced a new family of laser chip products. The Fabry-Pérot laser chips, emitting at 1310 nm, are especially designed for uncooled transponders, transceivers and transmitters. The chips for 622 Mb/s, 1.25 Gb/s, 2.5 Gb/s and 10 Gb/s components are intended for short and intermediate reach applications like SONET/SDH and ATM data links and transceivers for Gigabit and 10 Gigabit Ethernet, OIF VSR-4, Fiber Channel, and InfiniBand. The 100 % Continue reading →

Modulight receives ISO 9001:2000 certification

February 28, 2002 by Seppo Orsila
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Tampere, February 28, 2002 – Modulight, Inc. has received ISO 9001:2000 certification from Bureau Veritas Quality International (BVQI). The ISO 9001 registration has been adopted as a worldwide standard for quality, assuring that companies fulfilling its requirements have a fundamental quality management system in place. ISO 9001 registration is recognized as a true sign of quality-oriented business in the global market place. Modulight’s President & CEO, Dr. Petteri Uusimaa, stated: “We are very satisfied that BVQI audits confirm our own and 2nd party experience on the Continue reading →